30jul2019
The MIT X THEi STEM Summer Camp 2019
Student Activity
The MIT X THEi STEM Summer Camp 2019, hosted by the Faculty of Science and Technology (FST) with the support of 8 students from the Massachusetts Institute of Technology (MIT), has ended in a great success. More than 130 Hong Kong secondary school students participated in two 4-day sessions starting on 30 July and 06 August respectively, experiencing STEM Education via practical workshops and fun-filled activities delivered by MIT and THEi students.
The various activities cover four main themes, namely “Culture”, “Design and Sustainability”, “Science and Engineering”, and “Artificial Intelligence and Robotics”, with the purpose to attract students of different disciplines of study. These activities include but not limit to bridge building, robotic car assembling and programming, design thinking and prototyping, water rockets making and launching, and cultural appreciation and sharing of college experience, which aim to enhance participants’ practical knowledge and international perspectives.
Besides on-campus activities, students also had the chance to visit the Lantau Link Viewing Platform, Zero Carbon Building, and Chai Wan Campus to learn about the real-life application of the principles they were taught during the workshops. The harsh weather conditions could not quench the enthusiasm and passion of the students as they took the opportunity to explore and broaden their scopes of learning, developing communication skills and preparing for a brighter future.
Students learnt rich practical knowledge and gained international perspectives
Ir Dr Lawrence Chan, the Executive Vice President of THEi, gave the welcoming remarks
Students assembled a robotic car under the guidance of the MIT students in the robotic workshop.
Students visited the Lantau Link Viewing Platform to learn the bridge design.
The truss bridge built by a group of students won the championship in the bridge design workshop.
Students presented their ideas in the design thinking workshop.